Relying on the high voltage coefficient of PZT thin film, micron- to millimeter-level mechanical vibrations and ultrasonic waves are excited by a high-frequency alternating electric field, which disturbs and guides the heat flow to achieve active heat dissipation.
By combining Si/SOI substrate film formation with MEMS technology, we can achieve fully automated production of material deposition, patterning, and packaging, creating a high-yield, ultra-thin, and compact fanless surface-mount heat dissipation system.
- High-performance heat dissipation, high back pressure and high airflow (greater than 1000Pa).
- Miniaturized, 2mm thick, surface mountable
- Ultrasonic convection
- Silicon-based microchannels
- Silent and low power consumption
