Company Introduction
Yuanjing Moore Microelectronics is a semiconductor company that focuses on the independent research, development, production and sales of piezoelectric thin film MEMS integrated fabrication technology, PZT thin film technology applied to piezoelectric and inductive-memory-computing integrated modules and MEMS series products.
Founded in 2017, Yuanjing Moore Microelectronics has two factory sites: Building 3, No. 333 Huangqing Road, Jiading District, Shanghai (National Intelligent Sensor Innovation Center) and Building 1, No. 17 Beitanghe East Road, Tianning District, Changzhou (Next Generation Information Industry Park), with a total factory area of approximately 15,000 square meters. The company is dedicated to the research and development and production of piezoelectric thin-film silicon-based MEMS (Thick Film), boasting a strong research team, high-level management, and a highly qualified and responsible workforce. It has established a complete R&D and production system from basic materials to module-level application products. The company is a Jiangsu Provincial High-tech Enterprise and a private technology enterprise, and a key entrepreneurial enterprise introduced through the ninth batch of the Longcheng Elite Talent Program. It won the first prize in the 2018 Changzhou Innovation and Entrepreneurship Competition.
Shanghai Yuanjing Moore Microelectronics Co., Ltd. possesses China's first MEMS low-temperature PZT piezoelectric thin film growth process platform (8-inch PZT piezoelectric thin film equipment) and IBE/ICP etching equipment, committed to providing customers with one-stop integrated services from design services, process development, wafer manufacturing to packaging and testing. Changzhou Yuanjing Moore Microelectronics Co., Ltd. mainly focuses on the research and development of MEMS devices, with production lines for MEMS heat sinks, PMUT ultrasonic sensors, piezoelectric speakers, and hydraulic pumps.
Our products are widely used in AI electronics, smart cars, network communications, silicon photonics manufacturing, security engineering, IoT, smart healthcare, and smart wearables. With the rapid development of AI, the company will focus on overcoming key technologies that challenge heat dissipation in electronic products.














